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| EMIF06-10006C2 IPADTM 6 line EMI filter and ESD protection Main product characteristics Where EMI filtering in ESD sensitive equipment is required: (R) Mobile phones and communication systems Computers, printers and MCU Boards Description The EMIF06-10006C2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. The EMIF06 Flip-Chip packaging means the package size is equal to the die size. This filter includes an ESD protection circuitry which prevents damage to the application when subjected to ESD surges up 15 kV. This device includes 6 EMIF filters. Flip-Chip (15 Bumps) Order Code Part Number EMIF06-10006C2 Marking FT Benefits Figure 1. Pin Configuration (bump side) EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Lead free coated package Very low PCB space consumption 2.92 mm x 1.29 mm Very thin package: 0.695 mm High efficiency in ESD suppression (IEC 61000-4-2 level 4) High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging O6 O5 O4 O3 O2 O1 C 9 8 7 6 5 4 3 2 1 I6 Gnd I5 I4 Gnd I3 I2 Gnd I1 A B Complies with the following standards: IEC 61000-4-2 level 4: 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883G - Method 3015-7 Class 3: 30 kV TM: IPAD is a trademeark of STMicroelectronics November 2006 Rev 1 1/9 www.st.com 9 Characteristics EMIF06-10006C2 1 Characteristics Figure 2. Basic cell configuration 100 100 Input 1 30 pF 30 pF Output 1 Input 4 30 pF 30 pF Output 4 100 100 Input 2 30 pF 30 pF Output 2 Input 5 30 pF 30 pF Output 5 100 100 Input 3 30 pF 30 pF Output 3 Input 6 30 pF 30 pF Output 6 Table 1. Symbol PR PT Tj Top Tstg Absolute Ratings (limiting values) Parameter and test conditions DC power per resistance Total DC power per package Maximum junction temperature Operating temperature range Storage temperature range Value 0.1 0.6 125 - 40 to + 85 125 Unit W W C C C Table 2. Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Symbol VBR IRM RI/O Cline Electrical Characteristics (Tamb = 25 C) Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between Input and output Capacitance per line IPP VF VCL VBR VRM IRM IR V I IF Test conditions IR = 1 mA VRM = 3.3 V per line I = 10 mA VR = 2.5 V, F = 1 MHz, 30 mV (on filter cells) Min. 5.5 Typ. 7 Max. 9 500 Unit V nA pF 80 50 100 60 120 70 2/9 EMIF06-10006C2 Characteristics Figure 3. 0.00 dB -12.50 S21 (db) attenuation measurements Figure 4. and Aplac simulation 00 Analog crosstalk measurements Aplac 7.62 User: ST Microelectronics dB -25 i3_o2.s2p -25.00 -50 -37.50 -75 Measurement Simulation f/Hz -50.00 100.0k 1.0M 10.0M 100.0M 1.0G -100 100k 1M 10M 100M 1G f/Hz Figure 5. Digital crosstalk measurements Figure 6. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one imput (Vin) and one output (Vout) Figure 7. ESD response to IEC 61000-4-2 (-15 kV air discharge) on one imput (Vin) and one output (Vout) Figure 8. Line capacitance versus applied voltage for filter C(pF) 100 90 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 F=1MHz Vosc=30mVRMS Tj=25C VR(V) 3/9 Characteristics Figure 9. Rbump Ii* Cz=41pF@0V Cbump Rsub Cz=41pF@0V Rsub Cbump EMIF06-10006C2 Aplac model Lbump Rs=100 Lbump Rbump Oi* sub Rsub Rbump Oi * = Output of each filter cell Ii* = Input of each filter cell sub Lbump Cgnd Lgnd Rgnd EMIF06-10006C2 model Ground return for each GND bump Figure 10. Figure 10: Aplac parameters aplacvar RS aplacvar Cz aplacvar Lbump aplacvar Rbump aplacvar Cbump aplacvar Rsub aplacvar Rgnd aplacvar Lgnd aplacvar Cgnd 100 41 pF 50 pH 20 m 1.2 pF 100 m 100 m 100 pH 0.15 pF 4/9 EMIF06-10006C2 Ordering Information Scheme 2 Ordering Information Scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version yy - xxx zz Cx Package C = Coated Flip-Chip x = 2: Lead free Pitch = 500 m, Bump = 315 m 5/9 Package information EMIF06-10006C2 3 Package information Figure 11. Flip-Chip Package dimensions 315 m 50 500 m 50 250 m 50 435 m 50 695 m 75 50 1 m 5 2.92 mm 50 m Figure 12. Foot print recommendations Figure 13. Marking Copper pad Diameter: 250 m recommended , 300 m max Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) 1.29 mm 50 m 0 E Solder stencil opening: 330 m Solder mask opening recommendation: 340 m min for 300 m copper pad diameter xxz yww 6/9 EMIF06-10006C2 Figure 14. Flip-Chip Tape and reel specification Dot identifying Pin A1 location 4 +/- 0.1 Package information O 1.5 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 0.73 +/- 0.05 All dimensions in mm In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Note: Note: More packing information is available in the application notes: AN1235: "Flip-Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements" 8 +/- 0.3 STE STE STE xxz yww User direction of unreeling xxz yww xxz yww 4 +/- 0.1 7/9 Ordering Information EMIF06-10006C2 4 Ordering Information Ordering code EMIF06-10006C2 Marking FT Package Flip-Chip Weight 5.9 mg Base qty 5000 Delivery mode Tape and reel 7" 5 Revision History Date 17-Nov-2006 Revision 1 First issue Description of Changes 8/9 EMIF06-10006C2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9 |
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